News

Home > Group News > Group News Archives: 2006

Print

Group News Archives

2006

2006.11.21 Sales of the new SU-3100 single-wafer cleaning system commence
Up to 8 built-in chambers and superior 300 wafer per hour productivity (PDF:139.5KB)PDF
2006.11.16 New production factory for semiconductor manufacturing equipment completed
Built to meet increased demand for wafer cleaning equipment (PDF:143.6KB)PDF
2006.11.16 Sales of a manufacturing system for producing TFT liquid crystal displays to be used with 8th generation glass substrates
Improved production efficiency for 50-inch class large displays (PDF:127.2KB)PDF
2006.11.16 New factory for flat panel display manufacturing equipment completed
Facility will support production and quality testing of manufacturing equipment for 8th and future generation glass substrates (PDF:138.5KB)PDF
2006.11.09 New equipment for the 8th generation LCD color filter manufacturing business
Featuring new technology that significantly reduces production costs (PDF:140.1KB)PDF
2006.10.16 SCREEN entered into an OEM agreement on Truepress Jet520 technology with IBM (PDF:103.4KB)PDF
2006.09.20 Development of first wafer cleaning equipment with bevel cleaning technology for semiconductor manufacturing industry
New cleaning technology requires no wafer polishing, reduces costs, and increases productivity (PDF:127.5KB)PDF
2006.07.20 SOKUDO CO., LTD.
Applied Materials and Dainippon Screen Sign Final Agreement to Form Sokudo Joint Venture Company (PDF:75.4KB)PDF
2006.07.05 Successful development of wafer cleaning technology for next-generation semiconductor manufacturing
Physical cleaning with extremely fine particles extends the range of devices that can be processed (PDF:114.2KB)PDF
2006.06.01 Construction of a new factory for flat panel display manufacturing equipment: Playing a major role in production and quality testing of manufacturing equipment for glass substrates from 8th generation onwards (PDF:137.0KB)PDF
2006.05.11 Constructing a new production factory for semiconductor manufacturing equipment: Increasing wafer cleaning equipment production capacity starting from November (PDF:134.5KB)PDF
2006.03.21 Dainippon Screen Manufacturing Co., Ltd. RECEIVES INTEL’S PRESTIGIOUS SUPPLIER CONTINUOUS QUALTIY IMPROVEMENT AWARD (PDF:103.3KB)PDF
2006.03.14 Hybrid CTP developed for the Package Printing Industry Image processing techniques obtained from CTPs for offset printers has been applied to flexographic and letter press printing (PDF:121.3KB)PDF
2006.01.26 Screen Releases a High-End Optical Pattern Inspector for Printed Circuit Boards World’s Highest Class of Inspection Precision and Speed Combined in an Inspector Suitable for both R&D and Mass Production (PDF:89.5KB)PDF

To top of page