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Osaka Prefecture North Earthquake Influence on Semiconductor Equipment Manufacturing

June 18, 2018

Doc. No.: SPE180618E

 

On this occasion, in the aftermath of the major earthquake which had its epicenter in north of Osaka (Kinki Region Osaka Prefecture) on Jun. 18, I herein report on our company situation (including group companies) and business impact study, including investigation into the status of key component suppliers and influence on our product shipments.

 

1. Company Facilities and Employee Impact

We have confirmed there are no facility damage or employee injuries at our company as well as at our two primary manufacturing locations (Hikone and Taga operations). Likewise, we have also confirmed no facility damage or employee injuries among our group companies.

 

2. Key Component Suppliers Impact

As of Monday, Jun. 18, 13:00 (Japan), there has been no notable damage among our key supplies, which may cause long-term component supply stoppages.
In cooperation with these suppliers, we continue to investigate and confirm if there will be any impact on materials, parts supplies and logistics.

 

3. Screen Product Shipment Status

We have confirmed as of Jun. 18, 13:00 (Japan) that there will not be any delays in our product manufacturing or scheduled shipment.

 

 

 

 

Contact:
SCREEN Semiconductor Solutions Co., Ltd.
Office of President
 +81-75-417-2527
speinfo@screen.co.jp


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